Huawei AI Chips Contain Advanced Parts From Rivals | Bloomberg Tech 10/3/2025

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Bloomberg’s Caroline Hyde and Ed Ludlow discuss findings that Huawei's Ascend AI processors contain advanced components from TSMC, Samsung, and SK Hynix. Plus, Rivian is reworking the manual release on its vehicle doors after employees and customers raised concerns over potential safety issues. And Beijing dangles the promise of investments in the US as it pushes President Donald Trump to reverse national-security restrictions on Chinese deals. -------- Like this video? Subscribe to Bloomberg Technology on YouTube: https://www.youtube.com/channel/UCrM7B7SL_g1edFOnmj-SDKg   Watch the latest full episodes of "Bloomberg Technology" with Caroline Hyde and Ed Ludlow here: https://www.youtube.com/playlist?list=PLfAX25ZLrPGTygCwn55voYZ_LYyKjxokJ   Get the latest in tech from Silicon Valley and around the world here: https://www.bloomberg.com/technology Connect with us on... X: https://twitter.com/technology Facebook: https://www.facebook.com/BloombergTechnology Instagram: https://www.instagram.com/bloombergbusiness/   Follow Ed Ludlow on X here: https://twitter.com/EdLudlow Follow Caroline Hyde on X here: https://twitter.com/CarolineHydeTV   Listen to the daily Bloomberg Technology podcast here: https://www.bloomberg.com/podcasts/series/bloomberg-technology   More from Bloomberg Business Connect with us on... X: https://twitter.com/business Facebook: https://www.facebook.com/bloombergbusiness Instagram: https://www.instagram.com/bloombergbusiness/ LinkedIn: https://www.linkedin.com/company/bloomberg-news/ TikTok: https://www.tiktok.com/@bloombergbusiness