AMD ZEN 6 — Next-gen Chiplets & Packaging

Video Description

AMD's Infinity Fabric On-Package has been used since Zen 2 in 2019, it's time for a change! In this video we will discuss next-gen interconnect and packaging rumored to be introduced with Zen 6, including silicon interposer, silicon bridge and organic RDL technologies. Support the channel on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter/X: https://twitter.com/highyieldYT MLID Zen 6 leak video: https://www.youtube.com/watch?v=qpzTmKjaIMU 0:00 Intro 1:21 Infinity Fabric On-Package / Zen 2 3:22 Next-gen interconnects 3:46 Silicon Interposer Technology 6:12 Silicon Bridge Technology 9:22 Organic RDL Technology / AMD Infinity Links 13:11 Zen 6 Layout & Packaging 15:14 Conclusion